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Ni2Si-Nickel silicide

  • Molecular formula: Ni2Si
  • Density: 7.40 g/cm3
  • Melting point: 1255 °C (2291 °F; 1528 K)
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■ Specifications

 Product overview:

Nickel silicide (Ni2Si), used as the cathode of N-type thermocouples, has good thermoelectric stability above 1000 ℃ and has better oxidation resistance than that of E,J and K typesthermocouples.  
In the field of semiconductor materials, a variety of metal silicides have been studied for the contact and interconnection technology of semiconductor devices. MoSi2, WSi2 and Ni2Si have been successively introduced into the development of microelectronics devices. The silicon-based film of metal silicides has a good match with the silicon material itself, and it can be used for insulation, isolation, passivation and interconnection in silicon components.  The formation process of nickel silicide (Ni2Si) has low silicon consumption and low formation heat budget, low resistivity and no linewidth effect, so Ni2Si, as a nanoscale device, has been widely concerned and studied.

In graphene electrode, nickel silicide can delay the silicon electrode pulverization, cracking, and improve the conductivity of the electrode.  

 Whats more, Ni2Si alloy has wetting and spreading effect on SiC ceramics at different temperatures and atmospheres.  

Performance characteristics:

1, High purity: XRD detected no impurity phase;

2. Concentrated distribution: standard normal distribution of particle size, no bimodal or multi-modal.

 

■ Technical Data

 

Ni2Si-technical parameter

 

■ Inquiry
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Carbide series
Nitride series
Boride series
Silicide series
Elemental metal series
Nano material series
Oxide series
3D print&thermal spray series
Tetrachloride hafnium
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